Integrated electrical component within laminate

ABSTRACT

A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component. The first and second vias are in electrical contact with the first electrically-conductive layer and a first terminal of the electrical component, and with the second electrically-conductive layer and a second terminal of the electrical component, respectively.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/731,076, filed Apr. 14, 2017, which is incorporated herein byreference in its entirety and made a part hereof.

BACKGROUND OF THE INVENTION

Decorative laminates have been used as surfacing materials for manyyears, in both commercial and residential applications, where pleasingaesthetic effects in conjunction with desired functional behavior (suchas superior wear, heat and stain resistance, cleanability and cost) arepreferred. Typical applications have historically included furniture,kitchen countertops, table tops, store fixtures, bathroom vanity tops,cabinets, wall paneling, office partitions, and the like.

Laminates are useful as surfacing materials, including as decorativesurfaces, in many situations due to their combination of desirablequalities (e.g., superior wear, heat and stain resistance, cleanability,and cost). Laminate surfaces are composed of discrete layers, such aslayers of resin-impregnated kraft paper that are pressed to form thelaminate. One conventional decorative laminate is made by stacking threesheets of kraft paper (e.g., three sheets of phenol-formaldehyderesin-impregnated kraft paper), dry decorative paper (e.g., a printsheet), and a sheet of treated overlay paper (e.g.,melamine-formaldehyde resin-impregnated tissue paper or acrylicresin-impregnated tissue paper), one on top of another and then bondedtogether with heat and pressure.

A high-pressure laminate process (HPL) is an irreversible thermalprocess wherein resin-impregnated sheets of kraft paper undergo asimultaneous pressing and heating process at relatively high levels ofheat and pressure, such as temperatures greater than or equal to 125° C.and at least 5 mega Pascals (MPa) of pressure, typically for a presscycle of 30-50 minutes. An HPL process contrasts with low pressurelaminate processes (LPL) that is conducted at pressures of less than 5.0MPa, typically between 2-3 MPa.

SUMMARY OF THE DISCLOSURE

This summary is provided to introduce a selection of concepts in asimplified form that are further described in the Detailed Descriptions.This summary is not intended to identify key features or essentialfeatures of the claimed subject matter, nor is it intended to be used tolimit the scope of the claimed subject matter.

A laminate with an integrated electrical component (e.g., a capacitor,resistor, transistor, integrated circuit, etc.) embedded within thelaminate comprising a first paper layer having at least first and secondvias through the first paper layer, a first electrically-conductivelayer comprising an electrically-conductive material, the firstelectrically-conductive layer being disposed over a portion of the firstpaper layer, a second electrically-conductive layer comprising theelectrically-conductive material, the second electrically-conductivelayer being disposed over another portion of the first paper layer, anelectrical component disposed over the first and secondelectrically-conductive layers, the electrical component having at leastfirst and second electrical terminals, an insulating layer disposed overthe electrical component, wherein the first paper layer and theinsulating layer encapsulate the first electrically-conductive layer,the second electrically-conductive layer, and the electrical componentwithin the laminate, wherein the first and second vias include anelectrically-conductive material therein, the firstelectrically-conductive layer is electrically coupled to the first viaand the first electrical terminal, the second electrically-conductivelayer is electrically coupled to the second via and the secondelectrical terminal is disclosed.

A method for manufacturing a laminate with an integrated electricalcomponent (e.g., a capacitor, resistor, transistor, integrated circuit,etc.) embedded within the laminate comprising forming at least first andsecond via holes through a first paper layer, disposing a firstelectrically-conductive layer over a portion of the first paper layer,wherein the first electrically-conductive layer comprises anelectrically-conductive material, disposing a secondelectrically-conductive layer over another portion of the first paperlayer, wherein the second electrically-conductive layer comprises anelectrically-conductive material, disposing an electrical component overthe first and second electrically-conductive layers, the electricalcomponent having at least first and second electrical terminals, fillingthe first and second via holes with an electrically-conductive material,disposing an insulating layer over the electrical component, andcompressing the first paper layer, first and secondelectrically-conductive layers, the electrical component, and theinsulating layer, according to a lamination process, thereby formingfirst and second vias in the first and second via holes, the first viaelectrically coupling the first electrically-conductive layer to thefirst electrical terminal, and the second electrically-conductive layerto the second electrical terminal, and encapsulating the electricalcomponent within the laminate is disclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of an example of a laminate surfacingmaterial integrated into a countertop with an electroluminescent elementdisposed on multiple layers within the laminate;

FIG. 2 shows an example of a laminate having an integrated electricalcomponent within the laminate;

FIG. 3 generally illustrates example operations for forming anelectrical via between layers in a laminate using a masking technique;

FIG. 4 generally illustrates example operations for forming anelectrical via between layers in a laminate using a hole cuttingtechnique;

FIG. 5 shows a flowchart for manufacturing a laminate having anintegrated electrical component disposed on multiple layers within thelaminate;

FIG. 6 shows an example of a laminate having one or more integratedelectrical components disposed on multiple layers within the laminate;

FIG. 7 shows an example of a laminate having one or more integratedelectrical components disposed on multiple layers within the laminate.

DETAILED DESCRIPTION

A laminate with an integrated electrical component (e.g., a capacitor,resistor, transistor, integrated circuit, etc.) embedded within thelaminate comprising a first paper layer having at least first and secondvias through the first paper layer, a first electrically-conductivelayer comprising an electrically-conductive material, the firstelectrically-conductive layer being disposed over a portion of the firstpaper layer, a second electrically-conductive layer comprising theelectrically-conductive material, the second electrically-conductivelayer being disposed over another portion of the first paper layer, anelectrical component disposed over the first and secondelectrically-conductive layers, the electrical component having at leastfirst and second electrical terminals, and an insulating layer disposedover the electrical component is disclosed. In embodiments, the firstpaper layer and the insulating layer may encapsulate the firstelectrically-conductive layer, the second electrically-conductive layer,and the electrical component within the laminate. The first and secondvias include the electrically-conductive material therein. The firstelectrically-conductive layer may be electrically coupled to the firstvia and the first electrical terminal, and the secondelectrically-conductive layer may be electrically coupled to the secondvia and the second electrical terminal, the first via making electricalcontact with the first electrically-conductive layer and the firstelectrical terminal, and the second via making electrical contact withthe second electrically-conductive layer and the second electricalterminal. In certain embodiments, the insulating layer may comprise adecorative layer. For example, the insulating layer may comprise aresin-impregnated decorative layer. As another example, the insulatinglayer may comprise a treated overlay paper layer. When the insulatinglayer comprises a treated overlay paper layer, the laminate may furthercomprise a dry or untreated decorative paper (also known as a printsheet) between the treated overlay paper layer and the second paperlayer. Of course, the laminate may also comprise glue film layers, forexample when untreated kraft paper layers are included as furtherdescribed below.

Generally, as used herein, a “decorative layer” is a visible outer layerin the (final, assembled) laminate. A decorative layer may havedecorative colors and/or designs. Of course, as mentioned above, anoverlay layer may be disposed above a decorative layer provided that thedecorative layer is at least partially visible through the overlaylayer.

A laminate surfacing material, disposed on different paper layers (e.g.,resin-impregnated paper layers), which includes an embedded electricalcomponent, has particularly useful characteristics, including: theability to add more electrical components in a space-efficient manner byproviding additional electrical components and electrically-conductivematerials on different layers of the laminate; favorableheat-dissipation properties due to the lack of insulating air inside thelaminate and optional use of fillers with high heat transfercoefficients (e.g., ceramics such as aluminum nitride, aluminum oxide,boron nitride, and combinations thereof) in the resin formulations usedto prepare the resin-impregnated paper layers such that heat transferaway from the electrical component is enhanced, effectively turning thelaminate surfacing material into an efficient heat sink and facilitatingthe utilization of the electrical element; unexpected and surprisingelectrical conductivity of the electrically-conductive material used toprovide the electrical component even after undergoing an HPL process;greatly increased durability, prevention of whisker formation, makingthe circuitry water-proof, dust/sand resistance, moderate flexibility,and the ability to be integrated into almost any surface (e.g.,countertop, wall, piece of furniture, door, window frame, interior of avehicle, etc.). The resin-impregnated paper layers also provide adurable enclosure for the electrical component.

The electrical component may be disposed over a firstelectrically-conductive layer and a second electrically-conductivelayer. The first and second electrically-conductive layers each compriseelectrically-conductive material (e.g., electrically-conductive ink)disposed onto a first paper layer (e.g., kraft paper) having at leastfirst and second via holes cut through the paper layer for electricallycoupling the electrical component by filling the first and second viaholes with an electrically-conductive material. Disposing (e.g.,printing) the electrically-conductive material onto two differentportions of a first paper layer and other paper layers that may beincluded in the laminate allows the paper fibers to act asreinforcements for the electrical component, preventing breakage of theelectrical component due to shrinkage or expansion due to variousenvironmental conditions. The layers of the laminate are stacked,encapsulating the electrical component between discrete paper layersusing a lamination process. While low pressure lamination may be used toprepare laminates according to the disclosure, a high pressurelamination process including a re-cooling stage (referred to herein as“high pressure lamination”) is preferred.

As described herein, the electrical component is “encapsulated” orsubstantially protected by providing the electrically-conductivematerial for the electrical component on a first paper layer anddisposing an insulating layer above the electrically-conductive materialsuch that the electrical element is at least partially protected orshielded from ambient atmosphere by the overlying layer.

It has been found that when laminates are exposed to the heat andpressure in the high pressure lamination process, the risk of breakingor delamination of the electrical component is greatly reduced. The highpressure lamination process allows the electrical component toelectrically couple with electrically-conductive tracks having improvedtrack densification, which achieves surprisingly higher conductivitiesthan through other conventional manufacturing techniques. The highpressure lamination process allows for accurate control of temperatureand pressure (e.g., heating and cooling cycles) in order to control therate of dimensional change of layers and surprisingly leads to enhancedelectrical conductivity of the electrically-conductive material used inthe laminate process.

Various embodiments of the present disclosure are methods for preparingsuch laminates with the electrical component embedded within thelaminate. The methods include forming at least first and second viaholes through a first paper layer, disposing (e.g., inkjet printing,flexographic printing, gravure printing, screen printing, extrusionprinting, and the like) a first electrically-conductive layer (e.g.,electrically-conductive material) over a portion of the first paperlayer, disposing (e.g., inkjet printing, gravure printing, screenprinting) a second electrically-conductive layer (e.g.,electrically-conductive material) over another portion of the firstpaper layer, disposing an electrical component over the first and secondelectrically-conductive layers, filling the first and second vias withelectrically-conductive material, disposing an insulating layer over theelectrical component, and compressing the first paper layer, first andsecond electrically-conductive layers, the electrical component, theinsulating layer, and the filled first and second vias according to alamination process, thereby encapsulating the electrical componentwithin the laminate. The first and second vias may be provided atselected locations with electrically-conductive material such that thefirst electrically-conductive layer may be electrically coupled to thefirst via and a first electrical terminal of the electrical component,the second electrically-conductive layer may be electrically coupled tothe second via and a second electrical terminal of the electricalcomponent, the first via making electrical contact with the firstelectrically-conductive layer and the first electrical terminal, and thesecond via making electrical contact with the secondelectrically-conductive layer and the second electrical terminal.Factors in determining the selected locations may include efficientlayout design, avoiding shorting the electrical component, etc. Thelayers of the laminate may be stacked, encapsulating the electricalcomponent and electrically-conductive material between the first paperlayer and the insulating layer by subjecting the laminate to the highpressure lamination process, which surprisingly results inadvantageously enhanced densification of the electrical component,electrically-conductive material and excellent conductivity. It shouldbe noted that the same electrically-conductive material may be used forthe electrical component and the vias, but differentelectrically-conductive materials may also be used.

In one preferred embodiment, a method of making a laminated surfacematerial comprises providing at least an first untreated kraft paperlayer, a glue film layer, and an insulating layer; disposing first andsecond electrically-conductive layers over different portions of a firstuntreated kraft paper layer; disposing an electrical component over thefirst and second electrically-conductive layers; arranging a stackcomprising at least the first untreated kraft paper layer, the glue filmlayer, and the insulating layer such that the insulating layer isdisposed above the glue film layer; compressing the stack according to alamination process. Typically, the stack includes an additional gluefilm layer disposed below the first untreated kraft paper layer so as toallow a sufficient amount of resin to saturate the laminate during alamination process, in order to provide sufficient mechanical strengthto the final formed laminate. By providing the first and secondelectrically-conductive layers on untreated kraft paper, significantlyimproved alignment of holes formed in the stack can be achieved thanwhen the first and second electrically-conductive layers are disposed onresin-impregnated paper layers. A glue film layer as used herein is alayer having a sufficient amount of thermoset resin to saturate anadjacent untreated paper layer (e.g., a decorative layer or a kraftpaper layer). Typically, a glue film layer will comprise a paper layerhaving between 30-80 percent by weight of a thermoset resin. Preferably,the thermoset resin of the glue film comprises phenol-formaldehyderesin.

Thus, a preferred laminated surface material comprises a stackcomprising at least an first untreated kraft paper layer, a glue filmlayer, and an insulating layer such that the insulating layer isdisposed above the glue film layer; first and secondelectrically-conductive layers disposed over different portions of thefirst untreated kraft paper layer; an electrical component disposed overthe first and second electrically-conductive layers. Typically, thestack includes an additional glue film layer disposed below the firstuntreated kraft paper layer so as to allow a sufficient amount of resinto saturate the laminate during a lamination process, in order toprovide sufficient mechanical strength to the final formed laminate.

Electrically-conductive materials suitable for use in accordance withthe various embodiments of the present disclosure include any materialwhich can be disposed upon the first paper layer and other paper layersthat may be included as part of the laminate, such as resin-impregnatedpaper, and which may be electrically electrically-conductive. In someembodiments, the composition of the electrically-conductive materialincludes: (i) a particulate, electrically-conductive material; (ii) abinder; and optionally (iii) a microcrystalline cellulose component.

The particulate, electrically-conductive material may include any one ofmetals, alloys, electrically-conductive carbons (e.g.,electrically-conductive allotropes of carbon, graphites),electrically-conductive polymers (e.g., polypyrrole),electrically-conductive metallized polymers (e.g., metallizedpolyethylene terephthalates), and combinations thereof. In a preferredaspect, the particulate electrically-conductive material comprisessilver and/or silver alloys. Electrically-conductive ink compositionswhich may be disposed to provide electrically-conductive material on apaper layer and are thus suitable for use in various embodiments of thepresent disclosure typically include particles comprising metal, metalalloys, electrically-conductive carbon, or other electrically-conductivematerials such as polymers, in a carrier medium which may include otherpolymers, solvents and additives. Various known methodologies such asinkjet printing, screen printing, flexographic printing, gravureprinting, or extrusion printing may be used to dispose theelectrically-conductive ink compositions on the substrate.

One embodiment of an electrically-conductive ink composition suitablefor providing the particulate electrically-conductive material is anelectrically-conductive ink composition comprising: (i) a particulate,electrically-conductive material; (ii) a carrier liquid; (iii) a polymerbinder; and (iv) a microcrystalline cellulose component. Anotherembodiment of an electrically-conductive ink composition suitable forproviding the particulate electrically-conductive material is anelectrically-conductive ink composition comprising: (i) a particulate,electrically-conductive material; (ii) a carrier liquid; (iii) a polymerbinder; and (iv) a microcrystalline cellulose component; wherein theparticulate, electrically-conductive material comprises a componentselected from the group consisting of silver and silver alloys; andwherein the microcrystalline cellulose component is present in an amountof from about 0.05% to about 10% by weight based on the composition andhas an average particle size of from about 20 to about 100 μm. Incertain embodiments of the present disclosure, the microcrystallinecellulose component may include two or more microcrystalline celluloseshaving different average particle sizes. As noted above, disposingmethods such as inkjet printing, flexographic printing, gravureprinting, screen printing, and extrusion printing may dispose theelectrically-conductive material onto the paper layers, such as kraftpaper and overlay paper, but depending on the type of paper, theelectrically-conductive material may or may not penetrate completelythrough the paper.

If kraft paper (i.e., unbleached paper that is between 50-400 GSM (org/m²)) is used, and an electrically-conductive ink composition isdisposed thereon, the electrically-conductive material may penetratehalfway through the kraft paper, whereas if overlay paper (i.e.,bleached paper that is between 10-50 GSM) having less than half thebasis weight of kraft paper is used, and an electrically-conductive inkcomposition is disposed thereon, the electrically-conductive materialwill typically penetrate completely through the overlay paper. As such,in order to couple electrically-conductive material provided ondifferent layers of kraft paper together, apertures can be cut at leasthalfway through the kraft paper, so that electrically-conductivematerial disposed over a top surface of the kraft paper penetrateshalfway through the first kraft paper to form a via and establish anelectrical connection with a same type or different typeelectrically-conductive material provided on a top surface of a secondkraft paper layer underlying the first kraft paper layer. Becausedisposed electrically-conductive material may penetrate completelythrough overlay paper, it is not necessary to cut apertures in theoverlay paper to form a via and couple the electrically-conductivematerial disposed on a top surface of a first overlay paper layer to asame type or different type electrically-conductive material disposed ona top surface of a second paper layer disposed thereunder. Oncedisposed, the electrically-conductive material may be subject to thehigh pressure lamination process involving pressing at elevatedtemperature and pressure.

The electrically-conductive material described above may be disposed ina pattern over the first paper layer and other paper layers in variousembodiments of the present disclosure. Suitable patterns include, butare not limited to: continuous, meandering lines, spirals, circles,ovals, polyhedral shapes such as rectangles, squares, hexagons,octagons, spirangles, sawtooth waves, and combinations thereof.Preferably, electrically-conductive materials may be disposed inpatterns which provide a relatively large amount ofelectrically-conductive material on the paper layer while maintaining agap between adjacent portions of the electrically-conductive pathway.The cross-sectional area of any linear portion of anelectrically-conductive material may be important in circumstances whereelectrical resistance is to be minimized as the total electricalresistance of any electrically-conductive track is the product of thespecific resistance per square (related to cross-sectional area) and thetrack length. In other words, as understood by those skilled in the art,greater cross-sectional areas lead to lower overall track resistanceswhich lead to lower resistive heating for similar electric currentlevels.

It may be preferable to optimize the relationship between track verticalthickness, the cross sectional area and the pitch (i.e., the distancebetween two adjacent linear portions or tracks of theelectrically-conductive material disposed on a paper layer) which shouldbe controlled to be as small as possible while ensuring that the twoadjacent linear portions do not touch. It is also important to note thatthe pressure involved in the compression steps of the high pressurelamination process reduces the vertical thickness of theelectrically-conductive track. The overall effect on total electricalresistance may vary as the compression may increase specific resistanceof the electrically-conductive material by decreasing thecross-sectional area, while also increasing electrically-conductivecontact between electrically-conductive particles within theelectrically-conductive materials, thus decreasing resistance. Thus,various factors affect overall resistance. Preferably one or more suchfactors are considered in efforts to reduce overall resistance, andthus, heat generation.

The laminate in accordance with the various embodiments of the presentdisclosure may include one or more electrical contact pads which allowan electrical connection to be established to a via from the exterior ofthe laminate. In various embodiments wherein the laminate includes sameor different electrically-conductive materials connected together, asdescribed herein, the laminate may include an electrical contact padcoupled to a via providing a site for making an electrical connection toa first terminus of the first electrically-conductive material, and asecond electrical contact pad coupled to a second via providing a sitefor making an electrical connection to the second terminus of the secondelectrically-conductive material. The laminate may further be coupled toa component or components connected to the electrical contact pads onthe exterior of the laminate which component(s) are configured to acceptAC, or pulsed DC, voltage input from an electrical source such that theelectrically-conductive material(s) are provided with a current. Suchcomponents may include, but are not limited to various receptacles forAC and DC plugs, and terminal boxes or the like for hard-wiring AC or DCinputs. Electrical contact with the vias may also be established bycoupling any electrically-conductive material to the electrical contactpads using various structures including but not limited to metal tabs,screws, prongs, cylindrical receptacles, spring-loaded pins, etc.Additionally, methods of establishing permanent electrical contact canbe established by affixing an external component or conductor to theelectrical contact pads by soldering or the use of conductive adhesives.

A laminate's paper layers may be impregnated with resin such that thepaper layers, when stacked and compressed in the lamination process, canbe cured or cross-linked. The resin can be a thermoset resin such thatthe paper layers in a stacked relationship can be compressed and heatedto cure the thermoset resin. Specific suitable resins for use in thevarious embodiments of the present disclosure may differ depending onwhether the resin-impregnated paper layer is an outer protective layer(e.g., an insulating layer), or an interior core layer (e.g., a treatedkraft paper layer), or a base layer of the laminate surfacing material(e.g., a treated kraft paper layer). Generally, resin-impregnated paperlayers are impregnated with any suitable thermoset resin including, butnot limited to, acrylics, polyesters, polyurethanes, phenolics,phenol-formaldehydes, urea-formaldehydes, aminoplastics, melamines,melamine formaldehydes, diallyl-phthalates, epoxides, polyimides,cyanates, and polycyanurates, or copolymers, terpolymers or combinationsthereof. Phenol-formaldehydes are generally preferred for impregnatingkraft paper and acrylics or melamine-formaldehydes are generallypreferred for impregnating overlay paper. As used in this disclosure, aninsulating layer may be a translucent layer. A translucent layer meansany layer that permits at least some light to pass there through. Inother words, layers that are partially opaque are included astranslucent layers.

In some implementations, resin-impregnated paper layers which are corelayers are impregnated with a phenolic and/or epoxy resin, such as, forexample, a phenolic-formaldehyde resin. Impregnating paper layers with aresin can be carried out in any suitable manner sufficient to apply acontrolled quantity of resin to the paper, including but not limited to,screen printing, rotary screen printing, dip and squeeze, dip andscrape, reverse roll-coating, Meyer bar, curtain coating, slot-dye andgravure roller. The weight percentage of resin applied, relative to theweight of the paper layer as measured on an oven dried basis, may be inthe range of about 5 to 75%, with a preferred resin content percent(determined relative to final weight) of about 15-45%. As the resinsused in the impregnating step are normally aqueous or solvent basedsolutions, it is common in the laminating process to include a paperdrying stage to reduce the paper solvent loading. In the variousembodiments of the present disclosure, the weight percent level ofresidual solvent in the impregnated paper may be 2.5-15% with a typicallevel of about 5%. As used herein, cured can refer to both curing of athermoset resin in the sense of its irreversible setting, or thecrosslinking of other polymers with a separate cross-linker or byvarious forms of energy, or any means of fixing the resin when thelaminate surfacing material is in its compressed form such that theelectrically-conductive materials are encapsulated and will remain soduring normal operation.

Suitable papers which may be used in resin-impregnated paper layers inaccordance with the various embodiments of the present disclosureinclude but are not limited to: cellulose fiber, synthetic woven ornon-woven fiber, or/and microfiber or/and nanofiber, mixtures ofcellulose or/and synthetic fiber based papers or/and mineral fiber basedpapers or/and glass fiber based papers, coated or non-coated,pre-impregnated or non pre-impregnated that could be generally used forthe production of laminates. In various embodiments of the presentdisclosure, paper suitable for use in resin-impregnated paper layers hasat least one of the following properties: a minimum wet strength in themachine direction of 1400 cN/30 mm in accordance with the test method ofthe International Standard DIN ISO 3781, a Klemm absorbency range(capillary rise) in the machine direction of 30 to 90 mm/10 min inaccordance with the test method of the International Standard DIN ISO8787 with a preferred absorbency of 45 mm/10 min, Ash content 0 to 50%depending of the intrinsic nature of the paper used in accordance withthe test method of the International Standard Din ISO 2144, a basisweight range of 10 to 400 GSM at moisture content range of 2 to 8% inaccordance with the test method of the International Standard DIN ISO536, a pH (on hot extract) between about 4 to 9 in accordance with thetest method of the International Standard DIN ISO 6588. In variousembodiments of the present invention, papers comprising at least aportion of recycled materials may be used.

In various preferred embodiments of methods of manufacturing surfacingmaterials in accordance with the present disclosure, the high pressurelamination process may be employed. In accordance with such variouspreferred embodiments, the multiple layers, including both paper layersand layers of the electrical component according to any of thepreviously described embodiments are positioned in a stackedrelationship between two pressing plates. In such a high pressurelamination process, the plates are then pressed to a specific pressureof at least 5 MPa. The temperature is then raised in excess of 125° C.,typically to about 140° C. The plates are then held at the elevatedpressure and temperature for a period of time suitable for curing theresin. The temperature may then be lowered to 40° C., while maintainingthe elevated pressure. The typical cycle time under pressure is betweenabout 25 and about 50 minutes. Upon achieving a temperature of 40° C.,the pressure on the plates may then be reduced to zero gauge pressure.While it is important to take care in ensuring that the stacked layersare aligned where a conductive connection between adjacentelectrically-conductive materials through an aperture in an interveninglayer is to be established, the layers need not otherwise be placed inperfect edge to edge alignment, as a post-pressing trimming may becarried out to shape the final surfacing material.

While resin-impregnated layers are typically used to prepare thelaminates comprising an electrical element disposed on discrete layersof the laminate according to the disclosure, alternatively, paper layershaving pressure-sensitive adhesives thereon can be compressed with thepressure-sensitive adhesives in a facing relationship to form acomparable laminate structure. In such a process, a mask can be appliedat any locations where vias are desired in the final laminate product tofacilitate via formation, similar to the procedure described herein withreference to FIG. 3.

FIG. 1 is a schematic diagram of an example of electrically functionalsystem 100 including a laminate surfacing material 106 with an embeddedelectrical component on multiple layers integrated into a countertop102. Other types of surfaces may also be covered with the laminatesurfacing material 106 (e.g., wall, door, window, piece of furniture,interior of a vehicle, etc.). The laminate surfacing material 106 mayinclude the electrically-conductive material described above disposed aselectrically electrically-conductive tracks to electrically couple withthe embedded electrical component within the laminate surfacing material106. In an implementation, electrically-conductive material may not bedisposed throughout the entire area covered by the laminate surfacingmaterial (e.g., the entire countertop 102), but rather are located inonly a portion of the laminate surfacing material, such as in a markeddesignated area 118.

Bubble 104 illustrates a cross-section view of an example laminateincluding the electrical component disposed on different layers of thelaminate. In an implementation, electrically-conductive material (e.g.,electrically-conductive ink) is disposed in the shape ofelectrically-conductive plates on paper layers of the substrate.Throughout this disclosure, references to electrically-conductivematerial or ink should be understood to include theelectrically-conductive material or ink itself in addition toelectrically-conductive particles left behind after theelectrically-conductive material or ink has dried.

Several layers forming the laminate surfacing material to house theelectrical component are generally illustrated in bubble 104. In thecross-section view of bubble 104, paper layer 112, optional additionalpaper layers 114, 116, optional decorative paper layer 110, andinsulating layer 108 are visible along the cross-section. Paper layers112-116 each illustrate at least first and second via holes through eachlayer. In an implementation, electrically-conductive material may bedisposed on one or more layers 112-116 constituting the laminatesurfacing material 106. It should be understood that throughout thisapplication via holes are alternatively referred to as vias onceconductive material is included therein and a lamination process thatestablishes electrical contact between electrically conductive elementsis performed. In such a cross-section view, an integrated electricalcomponent embedded in layers 112-116 of the laminate surfacing materialmay extend linearly along the line L or may be in a directionperpendicular to the line L, in which case the layers of theelectrically-conductive material or electrical component would appearshorter in the cross-section view because only the width of theelectrically-conductive track, and not the length, would be visible.

In use, the surface 102 may be equipped with an electronic device, suchas a power supply to provide AC, or pulsed DC, voltage such that theelectrically-conductive material and the integrated electronic componentare provided with a current. The electronic device may be electricallyconnected to the electrically-conductive material(s) disposed in layers112-116 or the integrated electronic component to provide the voltage.In at least one implementation, the electronic device may be physicallyenclosed in a structure beneath surface 102 and user interface controlsare displayed to the user via surface 102 (e.g., LED lights embedded insurface 102, a control panel installed in surface 102, etc.).

FIG. 2 shows an example of laminate surfacing material 106 having anintegrated electrical component disposed within the laminate, as shownin laminate 200. Specifically, as shown in row 202, laminate 200includes a paper layer 112 (e.g., kraft paper) and an insulating layer108, as described in FIG. 1, between which an electrically-conductivelayer (e.g., a first electrically-conductive layer, a secondelectrically-conductive layer) and electrical component will bedisposed. The paper layer 112 may be impregnated with resin, such asphenolic resin. The insulating layer 108 may be untreated (e.g., tissuepaper or any suitable paper not treated with melamine resin), treatedoverlay (e.g., paper treated with melamine resin), clear plastic film,glass, film provided on a decorative paper layer, or two or more of theaforementioned stacked together. The first and secondelectrically-conductive layers may be disposed by various methodologies,such as inkjet printing, screen printing, flexographic or gravureprinting, extrusion printing, and three-dimensional printing. Thelaminate 200 may also include additional paper layers 114, 116 (e.g.,kraft paper) and a decorative paper layer 110 (e.g., print sheet) asneeded. The additional paper layers 114, 116 may be impregnated withresin, such as phenolic resin, and the decorative paper layer 110 may beuntreated, and thus dry.

As shown in row 204, any one or more of the paper layers 112-114 mayinclude a hole or via that may be formed or cut through the entire paperlayer. For example, paper layer 112 includes via holes 212, 218. If thelaminate 200 requires additional paper layers, additional paper layers114, 116 include via holes 210, 216 and via holes 208, 214,respectively. The via holes described may be formed, cut through, orpunched through, such as by a mechanical device or a laser, such thatupon stacking paper layers on top of each other, the vias traverse eachother. For example, via holes 208, 210, and 212 are vertically alignedwith each other and vias 214, 216, and 218 are vertically aligned witheach other when paper layers 112-116 in row 204 are stacked on top ofeach other. As such, vias of one paper layer may be vertically alignedwith vias of another paper layer.

As shown in row 206, an electrically-conductive material may be disposedover a portion of paper layer 112 to form a firstelectrically-conductive layer 220. Similarly, theelectrically-conductive material may be disposed over another portion ofpaper layer 112 to form a second electrically-conductive layer 222. Invarious embodiments of the present disclosure, one or moreelectrically-conductive materials may be disposed on either side or bothof one or more paper layers. The electrically-conductive materials maybe disposed in any shape, size, and may even form an outline of anaesthetic design. Electrically-conductive materials suitable for use inaccordance with the various embodiments of the laminate 200 include anymaterial which can be disposed upon paper, particularlyresin-impregnated paper, and which may be electricallyelectrically-conductive. Suitable electrically-conductive materialsinclude metals, alloys, and electrically-conductive inks.Electrically-conductive inks are commercially available from a number ofsources and can be prepared using a number of known methods.Particularly preferred electrically-conductive inks suitable for use invarious preferred embodiments of the present disclosure include silverand/or electrically-conductive carbon particles.

As shown in row 224, an electrical component 226 may be disposed (e.g.,disposed) over the first electrically-conductive layer 220 and thesecond electrically-conductive layer 222. Specifically, a first terminal228 of the electrical component 226 may be electrically coupled to thefirst electrically-conductive layer 220, and a second terminal 230 ofthe electrical component 226 may be electrically coupled to the secondelectrically-conductive layer 222. By filling the via holes 212, 218with the electrically-conductive material, the firstelectrically-conductive layer 220 may be electrically coupled to the via212 and the first terminal 228 of the electrical component 226 becausethe via 212 makes electrical contact with the firstelectrically-conductive layer 220 disposed over paper layer 112.Similarly, the second electrically-conductive layer 222 may beelectrically coupled to the via 218 and the second terminal 230 of theelectrical component 226 because the via 218 makes electrical contactwith the second electrically-conductive layer 222 disposed over paperlayer 112. Although a two-terminal electrical component 226 is shown, itmay be contemplated that electrical component 226 may have fewer oradditional terminals. For instance, if electrical component 226 hasthree terminals, the third terminal may be electrically coupled to athird electrically-conductive layer that may be electrically coupled toa third via, such that the third electrically-conductive layer may bedistinct from the first electrically-conductive layer 220 and the secondelectrically-conductive layer 222, and such that the third via may bedistinct from vias 212, 218. Such a three-terminal electrical componentis described below with respect to FIG. 6 and FIG. 7.

The electrically-conductive material used to fill via holes 212 and 218may be the same or different material as the electrically-conductivematerial disposed over paper layer 112 to form the firstelectrically-conductive layer 220 and the second electrically-conductivelayer 222. If additional paper layers 114, 116 are disposed on the sideof the paper layer 112 opposite the first electrically-conductive layer220 and second electrically-conductive layer 222, theelectrically-conductive material may fill via holes 208, 210 and beelectrically coupled to the first electrically-conductive layer 220 withvia 212. Similarly, the electrically-conductive material may fill viaholes 214, 216 and be electrically coupled to the secondelectrically-conductive layer 222 with via 218. If needed, thedecorative paper layer 110 may be disposed between the electricalcomponent and the insulating layer 108.

The paper layer 112 and the insulating layer 108 encapsulate the firstelectrically-conductive layer 220, the second electrically-conductivelayer 222, and the electrical component 226 within the laminate 200.Specifically, after the layers described above undergo the high pressurelamination process, the resin that may be impregnated in the paper layer112 consolidates the first electrically-conductive layer 220, the secondelectrically-conductive layer 222, and the electrical component 226 intoa continuous resin structure, thereby forming the laminate 232.

FIG. 3 illustrates an example operation 300 for forming an electricalvia, such as vias 212, 218 of FIG. 2 between paper layers in a laminateusing a masking technique. A paper layer for a laminate including anelectrical component may be prepared with a sheet of untreated kraftpaper 314 (e.g., paper layer 112 of FIG. 2) and partially covered with aremovable mask 316 on one side of untreated paper sheet 314 at alocation of a desired electrical connection through the paper 314 atoperation 302.

A resin-treating operation 304 impregnates the kraft paper 314 with aresin to form resin-treated paper 322. The mask 316 protects a portion324 of the resin-treated kraft paper 322 during the resin-treatingoperation 304 and the portion 324 does not become impregnated with theresin. A removing operation 306 removes the mask 316, exposing theuntreated region 324 of the resin-treated kraft paper 322.

A disposing operation 308 disposes electrically-conductive material(e.g., the first electrically-conductive material 318) onto theuntreated region 324 of the resin-treated kraft paper 322. Theelectrically-conductive material saturates untreated region 324, butdoes not saturate the resin-treated region of kraft paper 314, therebyallowing for electrical conductivity through the paper 314.

FIG. 4 illustrates an example operation 400 for forming an electricalvia between layers in a laminate using a hole cutting technique. A holeforming operation 400 forms a via hole in a layer of a laminate. Forexample, hole forming operation 400 may form via holes 408, 412 in layer406. With reference to FIG. 2, vias 408, 412 may be vias 212, 218,respectively. Layer 402 may be an insulating layer 108, layer 404 may bedecorative paper layer 110, and layer 406 may be paper layer 112. Thematerial 410 disposed on layer 406 may be electrically-conductivematerial to form the first electrically-conductive layer 220. Thematerial 414 disposed on layer 406 may be electrically-conductivematerial to form the second electrically-conductive layer 222. Anelectrically-conductive material may fill via hole 408 to electricallycouple to material 410, once a lamination process is performed.Similarly, an electrically-conductive material may fill via 412 toelectrically couple to material 414 once a lamination process isperformed.

FIG. 5 shows a flowchart for manufacturing a laminate having anintegrated electrical component disposed within the laminate accordingto one embodiment. The method 500 may be implemented, in whole or inpart, by cutting, disposing and high pressure lamination processsystem(s), implemented by one or more processors, sensors, and/orcomputer-executable instructions stored on non-transitorycomputer-readable medium or media.

The method 500 may begin by forming first and second via holes through afirst paper layer (block 502). With reference to FIG. 2, the method 500may form a hole or via that may be formed or cut through the entirepaper layer. For example, method 500 may form via holes 212, 218 throughpaper layer 112. If the laminate 200 requires additional paper layers,method 500 may form via holes 210, 216 and vias 208, 214 on additionalpaper layers 114, 116, respectively. The vias described may be formed,cut through, or punched through, such as by a mechanical device or alaser, such that upon stacking paper layers on top of each other, thevias traverse each other. For example, via holes 208, 210, and 212 arevertically aligned with each other and via holes are vertically alignedwith 214, 216, and 218 when paper layers 112-116 in row 204 are stackedon top of each other. As such, vias of one paper layer may be verticallyaligned with vias of another paper layer.

Method 500 proceeds by disposing a first electrically-conductive layerover a portion of the first paper layer, the firstelectrically-conductive layer including an electrically-conductivematerial (block 504). With reference to FIG. 2, method 500 may disposean electrically-conductive material over a portion of the paper layer112 to form a first electrically-conductive layer 220. In this step, thefirst via hole is typically also filled. Similarly, method 500 proceedsby disposing a second electrically-conductive layer over another portionof the first paper layer, the second electrically-conductive layerincluding the electrically-conductive material (block 506). In thisstep, the second via hole can be filled. In blocks 504 and 506, withreference to FIG. 2, method 500 may dispose an electrically-conductivematerial over a portion of the paper layer 112 to form a firstelectrically-conductive layer 220 and over another portion of the paperlayer 112 to form a second electrically-conductive layer 222. Theelectrically-conductive materials may be disposed in any shape, size,and may even form an outline of an aesthetic design. Disposing theelectrically-conductive material may involve disposingelectrically-conductive material over top of and into one or more viaholes. Electrically-conductive materials suitable for use include anymaterial which can be disposed upon paper, particularlyresin-impregnated paper, and which may be electricallyelectrically-conductive. Suitable electrically-conductive materialsinclude metals, alloys, and electrically-conductive inks.Electrically-conductive inks are commercially available from a number ofsources and can be prepared using a number of known methods.Particularly preferred electrically-conductive inks suitable for use invarious preferred embodiments of the present disclosure include silverand/or electrically-conductive carbon particles. Method 500 may disposeadditional paper layers 114, 116 on the side of the paper layer 112opposite the first electrically-conductive layer 220 and the secondelectrically-conductive layer 222. Alternatively, additional paperlayers 114, 116 may be disposed on the same side of the paper layer 112as the first electrically-conductive layer 220 and the secondelectrically-conductive layer 222.

Method 500 proceeds by disposing (e.g., surface mounting, affixing withan adhesive, affixing without an adhesive) an electrical component overthe first and second electrically-conductive layers, the electricalcomponent having a first and second electrical terminals (block 508).With reference to FIG. 2, method 500 may dispose electrical component226 over the first electrically-conductive layer 220 and the secondelectrically-conductive layer 222. Because of the disposing step, thefirst terminal 228 of the electrical component 226 may be electricallycoupled to the first electrically-conductive layer 220, and the secondterminal 230 of the electrical component 226 may be electrically coupledto the second electrically-conductive layer 222.

Method 500 proceeds by filling the first and second via holes with anelectrically-conductive material (block 510). With reference to FIG. 2,by filling the vias 212, 218 with the electrically-conductive material,the first electrically-conductive layer 220 may be electrically coupledto the via 212 and the first terminal 228 of the electrical component226 because the via 212 makes electrical contact with the firstelectrically-conductive layer 220 disposed over paper layer 112 after alamination process is performed. Similarly, the secondelectrically-conductive layer 222 may be electrically coupled to the via218 and the second terminal 230 of the electrical component 226 becausethe via 218 makes electrical contact with the secondelectrically-conductive layer 222 disposed over paper layer 112 after alamination process is formed. The electrically-conductive material usedto fill via holes 212 and 218 may be the same or different material asthe electrically-conductive material disposed over paper layer 112 toform the first electrically-conductive layer 220 and the secondelectrically-conductive layer 222.

Method 500 proceeds by disposing an insulating layer over the electricalcomponent (block 512). With reference to FIG. 2, the paper layer 112 andthe insulating layer 108 encapsulate the first electrically-conductivelayer 220, the second electrically-conductive layer 222, and theelectrical component 226 within the laminate 200. Specifically, afterlayers described above undergo the high pressure lamination process, theresin that may have impregnated the paper layer 112 consolidates thefirst electrically-conductive layer 220, the secondelectrically-conductive layer 222, and the electrical component 226 intoa continuous resin structure, thereby forming the laminate 232. Lastly,method 500 proceeds by compressing the first paper layer, disposed firstand second electrically-conductive layers, the disposed electricalcomponent, the disposed insulating layer, and the filled first andsecond vias according to a lamination process, thereby encapsulatingwith the first paper layer, the first electrically-conductive layer, thesecond electrically-conductive layer, and the electrical componentwithin the laminate (block 514).

By using vias, the disclosed laminate advantageously utilizes differentlayers to dispose an integrated electrical component within the laminate200. In addition, because the paper layer 112 and the insulating layer108 encapsulate the first electrically-conductive layer 220, the secondelectrically-conductive layer 222, and the electrical component 226within the laminate 200, the integrated electrical component may beprotected during usage of the laminate 200.

In addition to the advantages listed above, further advantages can berealized with additional structural modifications to the laminate 200.For instance, in order to encapsulate the first electrically-conductivelayer 220, the second electrically-conductive layer 222, and theelectrical component 226 into a continuous resin structure, rather thanimpregnating the paper layer 112 with a resin material, a glue filmlayer impregnated with a resin material may be disposed betweenuntreated paper layer 112 and the insulating layer 108. Similarly, ifdecorative paper layer 110 is needed, the glue film layer impregnatedwith a resin material may be disposed between the paper layer 112 andthe decorative paper layer 110. After undergoing the high pressurelamination process, the resin material from the glue film layer cansaturate untreated paper, such as untreated paper layer 112, untreateddecorative paper layer 110, and insulating layer 108, to encapsulate thefirst electrically-conductive layer 220, the secondelectrically-conductive layer 222, and the electrical component 226 intoa continuous resin structure.

Although the laminate 200 as illustrated includes paper layer 112 andoptional paper layers 114, 116, optional decorative paper layer 110, andan insulating layer 108, it should be understood that the presentdisclosure is not limited to the precise configuration shown. Forinstance, additional paper layers may be stacked below optional paperlayer 116. Such additional paper layers may provide space for disposingadditional electrical components and making any interconnections withthe electrical component 226 within the laminate structure.

For example, FIG. 6 shows an example of a laminate 600 having one ormore integrated electrical components within the laminate according toone embodiment. The laminate 600 may include any one or more oftransistor 618, resistor 630, an integrated circuit 636, capacitor 644,any other suitable electrical component integrated within the laminate600, or any combination thereof. As such, the electrical components mayhave any number of electrical terminals. The laminate 600 as shown doesnot require paper layer 606 (e.g., paper layers 606.1, 606.2, 606.3,and/or 606.4) to be impregnated with a resin material. Instead, in orderto encapsulate each of the aforementioned electrical components, a gluefilm layer 616 (e.g., 616.1, 616.2, 616.3, and/or 616.4) impregnatedwith resin material may be disposed between each of the untreated paperlayers 606.1, 606.2, 606.3, and/or 606.4 and the insulating layer 602.Similarly, if decorative paper layer 604 is needed, the glue film layer616.1, 616.2, 616.3, and/or 616.4 impregnated with resin material may bedisposed between the untreated paper layers 606.1, 606.2, 606.3, and/or606.4 and the decorative paper layer 604.

For 3-terminal transistor 618, as shown, first electrically-conductivelayer 610.1 may be electrically coupled to first via 608.1 (when filledwith electrically-conductive material) and the first electrical terminal618.1 of transistor 618, second electrically-conductive layer 614.1 maybe electrically coupled to second via 612.1 (when filled withelectrically-conductive material) and the second electrical terminal618.2 of transistor 618, and a third electrically-conductive layer 620may be electrically coupled to third via 622 (when filled withelectrically-conductive material) and the third electrical terminal618.3 of transistor 618. As such, untreated paper layer 606.1 mayinclude more than two via holes. Glue film layer 616.1 may have viaholes 624, 626, and 628 that traverse via holes 608.1, 622, and 612.1 ofuntreated paper layer 606.1 such that electrically-conductive materialmay electrically couple 3-terminal transistor 618 to otherelectrically-conductive layers or electrical components within thelaminate 600, such as resistor 630.

For 2-terminal resistor 630, as shown, first electrically-conductivelayer 610.2 may be electrically coupled to first via 608.2 (when filledwith electrically-conductive material) and the first electrical terminal630.1 of resistor 630, and second electrically-conductive layer 614.2may be electrically coupled to second via 612.2 (when filled withelectrically-conductive material) and the second electrical terminal630.2 of resistor 630. Glue film layer 616.2 may have via holes 632 and634 that traverse via holes 608.2 and 612.2 of untreated paper layer606.2 such that electrically-conductive material may electrically couple2-terminal resistor 630 to other electrical components orelectrically-conductive layers within the laminate 600 after alamination process is performed.

For multi-terminal integrated circuit 636 (e.g., microprocessor), asshown, first electrically-conductive layer 610.3 may be electricallycoupled to first via 608.3 (after being filled withelectrically-conductive material and a lamination process is performed)and the first electrical terminal 636.1 of integrated circuit 636, andsecond electrically-conductive layer 614.3 may be electrically coupledto second via 612.3 (after being filled with electrically-conductivematerial and a lamination process is performed) and the secondelectrical terminal 630.2 of integrated circuit 636. A third electricalterminal, such as 636.3, may be electrically coupled to a thirdelectrically-conductive layer 638. The third electrically-conductivelayer 638 may serve to electrically couple third electrical terminal636.3 to other terminals of electrical components, such as thirdelectrical terminal 618.3 of transistor 618. Glue film layer 616.3 mayhave via holes 640 and 642 that substantially aligned via holes 608.3and 612.3 of untreated paper layer 606.3 such thatelectrically-conductive material may electrically couple multi-terminalintegrated circuit 636 to other electrical components orelectrically-conductive layers within the laminate 600 after alamination process is performed.

For 2-terminal capacitor 644, as shown, first electrically-conductivelayer 610.4 may be electrically coupled to first via 608.4 and the firstelectrical terminal 644.1 of capacitor 644, and secondelectrically-conductive layer 614.4 may be electrically coupled tosecond via 612.4 and the second electrical terminal 644.2 of capacitor644. Glue film layer 616.4 may have via holes 646 and 648 that traversevia holes 608.4 and 612.4 of untreated paper layer 606.4 such thatelectrically-conductive material may electrically couple 2-terminalcapacitor 644 to other electrical components or electrically-conductivelayers within the laminate 600 after the vias are filled withelectrically-conductive material and a lamination process is performed.

The untreated paper layer 606 (e.g., 606.1, 606.2, 606.3, and/or 606.4)and the insulating layer 602 may encapsulate the firstelectrically-conductive layer 610 (e.g., 610.1, 610.2, 610.3, and/or610.4), the second electrically-conductive layer 614.4 (e.g., 614.1,614.2, 614.3, and/or 614.4), and the electrical component (e.g., 618,630, 636, and/or 644) within the laminate 600.

FIG. 7 shows another example of a laminate 700 having one or moreintegrated electrical components within the laminate according to oneembodiment. The laminate 600 may include any one or more of transistor618, resistor 630, an integrated circuit 636, capacitor 644, or anyother suitable electrical component integrated within the laminate 600as shown in FIG. 6. However, in contrast to FIG. 6, such laminate 700may include one or more cutouts, such as cutouts 702 and/or 704, for theone or more integrated electrical components to traverse through thecutout. Generally, the cutout may be formed in any one or more paperlayer (e.g., second paper layer) disposed between the electricalcomponent and the insulating layer 602. For instance, as shown, cutout702 may be formed in glue film layer 616.2 and untreated paper layer606.2 for integrated circuit 636 to traverse through the cutout. Asanother example, for bulkier electrical components, cutout 704 may beformed in glue film layer 616.3, untreated paper layer 606.3, glue filmlayer 616.2, and untreated paper layer 606.2 for capacitor 644 totraverse through the cutout. It is contemplated that any number of gluefilm layers and untreated paper layers will be used to form the cutout,such that all or part of the electrical component traverses through thecutout. For example, if resistor 630 requires traversal of 3.43 mmvertically, a total of 9 layers comprising several untreated paperlayers and glue film layers, having a cutout traversing the layers, mayencapsulate resistor 630. Similarly, if the bulkier capacitor 644requires traversal of 14.29 mm vertically, 36 layers comprising severaluntreated paper layers and glue film layers, having a cutout traversingthe layers, may encapsulate capacitor 644. Various thickness ofelectrical components, and various number of layers, each of which maybe of varying thickness with varying amounts of impregnated resin toencapsulate the electrical components after undergoing a high pressurelamination process, are contemplated herein.

As used herein, the singular terms “a” and “the” are synonymous and usedinterchangeably with “one or more” and “at least one,” unless thelanguage and/or context clearly indicates otherwise. Accordingly, forexample, reference to “a paper layer” or “the paper layer” herein or inthe appended claims can refer to a single paper layer or more than onepaper layer. Additionally, all numerical values, unless otherwisespecifically noted, are understood to be modified by the word “about.”

For simplicity and clarity of illustration, elements in the figures arenot necessarily to scale, and the same reference numbers in differentfigures denote the same elements. For clarity of the drawing, layers andelectrically-conductive materials may be shown as having generallystraight line edges and precise angular corners. However, those skilledin the art understand that the edges need not be straight lines and thecorners need not be precise angles.

Certain terminology is used in the following description for convenienceonly and is not limiting. Ordinal designations used herein and an itappended claims, such as “first”, “second”, “third”, etc., are solelyfor the purpose of distinguishing separate, multiple, similar elements(e.g., a first paper layer and a second paper layer), and do not importany specific ordering or spatial limitations unless otherwise requiredby context.

The applications and benefits of the systems, methods and techniquesdescribed herein are not limited to only the above examples. Many otherapplications and benefits are possible by using the systems, methods andtechniques described herein.

Moreover, although the foregoing text sets forth a detailed descriptionof numerous different embodiments, it should be understood that thescope of the patent is defined by the words of the claims set forth atthe end of this patent. The detailed description is to be construed asexemplary only and does not describe every possible embodiment becausedescribing every possible embodiment would be impractical, if notimpossible. Numerous alternative embodiments could be implemented, usingeither current technology or technology developed after the filing dateof this patent, which would still fall within the scope of the claims.

It will be appreciated by those skilled in the art that changes could bemade to the embodiments described above without departing from the broadinventive concept thereof. It is understood, therefore, that thisinvention is not limited to the particular embodiments disclosed, but itis intended to cover modifications within the spirit and scope of thepresent invention as defined by the appended claims.

What is claimed:
 1. A laminate having an integrated electrical component disposed within the laminate, the laminate comprising: a first paper layer; a first electrically-conductive layer comprising an electrically-conductive material, the first electrically-conductive layer being disposed over a portion of the first paper layer; a second electrically-conductive layer comprising the electrically-conductive material, the second electrically-conductive layer being disposed over another portion of the first paper layer; the electrical component disposed over the first and second electrically-conductive layers, the electrical component having at least first and second electrical terminals; an insulating layer disposed over the electrical component, and wherein the first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component within the laminate.
 2. The laminate of claim 1, further comprising: at least a second paper layer disposed between the electrical component and the insulating layer, the second paper layer comprising a cutout for the electrical component to traverse through the second paper layer.
 3. The laminate of claim 1, wherein the insulating layer is one of at least a resin-impregnated decorative paper or a treated overlay.
 4. The laminate of claim 3, further comprising: a decorative paper layer, the decorative paper layer being disposed between the electrical component and the insulating layer.
 5. The laminate of claim 1, wherein the first paper layer is impregnated with a resin material.
 6. The laminate of claim 5, wherein the resin material comprises a phenolic resin.
 7. The laminate of claim 1, wherein the first electrically-conductive layer or the second electrically-conductive layer comprises silver particles.
 8. The laminate of claim 1, further comprising: at least a third paper layer disposed on a side of the first paper layer opposite the first and second electrically-conductive layers.
 9. The laminate of claim 1, wherein the electrical component is at least one of a capacitor, resistor, transistor, or an integrated electrical component.
 10. The laminate of claim 1, wherein the electrically-conductive material comprises a particulate, electrically-conductive material, a binder, and a microcrystalline cellulose component.
 11. The laminate of claim 1, wherein the first electrically-conductive layer and the second electrically-conductive layer are disposed onto the first paper layer.
 12. A solid surface comprising the laminate according to claim 1 disposed on a supporting substrate.
 13. A high pressure decorative laminate having an integrated electrical component disposed within the laminate, the laminate comprising: a first paper layer; a first electrically-conductive layer comprising an electrically-conductive material, the first electrically-conductive layer being disposed over a portion of the first paper layer; a second electrically-conductive layer comprising the electrically-conductive material, the second electrically-conductive layer being disposed over another portion of the first paper layer; the electrical component disposed over the first and second electrically-conductive layers, the electrical component having at least first and second electrical terminals, wherein the electrical component is at least one of a capacitor, resistor, transistor, or an integrated electrical component; an insulating layer disposed over the electrical component, wherein the insulating layer is one of at least a resin-impregnated decorative paper or a treated overlay, and wherein the first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component within the laminate.
 14. The high pressure decorative laminate of claim 13, further comprising: at least a second paper layer disposed between the electrical component and the insulating layer, the second paper layer comprising a cutout for the electrical component to traverse through the second paper layer.
 15. The high pressure decorative laminate of claim 13, further comprising: at least a third paper layer disposed on a side of the first paper layer opposite the first and second electrically-conductive layers.
 16. The high pressure decorative laminate of claim 13, further comprising: a decorative paper layer, the decorative paper layer being disposed between the electrical component and the insulating layer.
 17. The high pressure decorative laminate of claim 13, wherein at least one glue film layer impregnated with a resin material is disposed between the first paper layer and the decorative paper layer.
 18. The laminate of claim 13, wherein the electrically-conductive material comprises a particulate, electrically-conductive material, a binder, and a microcrystalline cellulose component.
 19. The laminate of claim 13, wherein the first electrically-conductive layer and the second electrically-conductive layer are disposed onto the first paper layer. 